Issued Patents 2017
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9842827 | Wafer level system in package (SiP) using a reconstituted wafer and method of making | Sam Ziqun Zhao | 2017-12-12 |
| 9837378 | Fan-out 3D IC integration structure without substrate and method of making the same | Sam Ziqun Zhao | 2017-12-05 |
| 9693461 | Magnetic-core three-dimensional (3D) inductors and packaging integration | Sam Ziqun Zhao, Edward Law, Sampath Komarapalayam Velayudham Karikalan, Neal Kistler, Pieter Vorenkamp | 2017-06-27 |
| 9548251 | Semiconductor interposer having a cavity for intra-interposer die | Sam Ziqun Zhao, Pieter Vorenkamp, Kevin Kunzhong Hu, Sampath K. V. Karikalan, Xiangdong Chen | 2017-01-17 |