Issued Patents 2017
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9693461 | Magnetic-core three-dimensional (3D) inductors and packaging integration | Sam Ziqun Zhao, Edward Law, Sampath Komarapalayam Velayudham Karikalan, Neal Kistler, Rezaur Rahman Khan | 2017-06-27 |
| 9548251 | Semiconductor interposer having a cavity for intra-interposer die | Rezaur Rahman Khan, Sam Ziqun Zhao, Kevin Kunzhong Hu, Sampath K. V. Karikalan, Xiangdong Chen | 2017-01-17 |