Issued Patents 2017
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9809446 | Semiconductor package and manufacturing method thereof | Jae Ung Lee, Young Seok Kim, Wook Choi, Seung Jae Yoo, Yung Woo Lee +2 more | 2017-11-07 |
| 9716071 | Semiconductor device redistribution layer with narrow trace width relative to passivation layer opening | Ji Yeon Ryu, Jae Beum Shim | 2017-07-25 |
| 9704747 | Semiconductor device and manufacturing method thereof | Ji Yeon Ryu, Jae Beum Shim | 2017-07-11 |
| 9673122 | Micro lead frame structure having reinforcing portions and method | Hyeong Il Jeon, Hyung Kook Chung, Hong-Bae Kim | 2017-06-06 |
| 9653336 | Semiconductor device and manufacturing method thereof | Yi Seul Han, Jae Beum Shim, In Bae Park | 2017-05-16 |
| 9633932 | Lead frame package having discharge hole and method of manufacturing the same | Kyoung Yeon Lee, Kyung Su Kim, Hyung Il Jeon, Jae Doo Kwon | 2017-04-25 |
| 9631481 | Semiconductor device including leadframe with a combination of leads and lands and method | Jae Min Bae, Won Bae Bang | 2017-04-25 |
| 9613829 | Method for fabricating semiconductor package and semiconductor package using the same | Seung Woo Lee, Won Bae Bang, Sang Goo Kang | 2017-04-04 |
| 9552999 | Packaged electronic device having reduced parasitic effects and method | Tae Ki Kim, Ji Young Chung, Gi Jeong Kim, Won Bae Bang | 2017-01-24 |
| 9543235 | Semiconductor package and method therefor | Hyung Il Jeon, Ji Young Chung, In Bae Park, Jae Min Bae, No Sun Park | 2017-01-10 |