Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9704725 | Semiconductor device with leadframe configured to facilitate reduced burr formation | Hyun Jun Kim, Hong-Bae Kim | 2017-07-11 |
| 9673122 | Micro lead frame structure having reinforcing portions and method | Hyeong Il Jeon, Hong-Bae Kim, Byong Jin Kim | 2017-06-06 |