Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9831282 | Electronic device package and fabricating method thereof | Jin Young Kim, Yoon Joo Kim, Seung Jae Lee, Se Woong Cha, Sung Kyu Kim +1 more | 2017-11-28 |
| 9543235 | Semiconductor package and method therefor | Hyung Il Jeon, Ji Young Chung, Byong Jin Kim, In Bae Park, Jae Min Bae | 2017-01-10 |