Issued Patents 2017
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9809446 | Semiconductor package and manufacturing method thereof | Jae Ung Lee, Byong Jin Kim, Young Seok Kim, Seung Jae Yoo, Yung Woo Lee +2 more | 2017-11-07 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9809446 | Semiconductor package and manufacturing method thereof | Jae Ung Lee, Byong Jin Kim, Young Seok Kim, Seung Jae Yoo, Yung Woo Lee +2 more | 2017-11-07 |