Issued Patents 2017
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9631481 | Semiconductor device including leadframe with a combination of leads and lands and method | Jae Min Bae, Byong Jin Kim | 2017-04-25 |
| 9613829 | Method for fabricating semiconductor package and semiconductor package using the same | Seung Woo Lee, Byong Jin Kim, Sang Goo Kang | 2017-04-04 |
| 9552999 | Packaged electronic device having reduced parasitic effects and method | Tae Ki Kim, Byong Jin Kim, Ji Young Chung, Gi Jeong Kim | 2017-01-24 |