Issued Patents 2017
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 9631481 | Semiconductor device including leadframe with a combination of leads and lands and method | Jae Min Bae, Byong Jin Kim | 2017-04-25 | $6,439,000 |
| 9613829 | Method for fabricating semiconductor package and semiconductor package using the same | Seung Woo Lee, Byong Jin Kim, Sang Goo Kang | 2017-04-04 | $23,786,000 |
| 9552999 | Packaged electronic device having reduced parasitic effects and method | Tae Ki Kim, Byong Jin Kim, Ji Young Chung, Gi Jeong Kim | 2017-01-24 | $11,797,000 |