Issued Patents 2017
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9837932 | Electronic device and electronic system and operation methods thereof | Chih-Ming Hsu | 2017-12-05 |
| 9748196 | Semiconductor package structure including die and substrate electrically connected through conductive segments | Jen-Kuang Fang | 2017-08-29 |
| 9589871 | Semiconductor package structure and method for manufacturing the same | Tang-Yuan Chen, Chin-Li KAO, Ming-Hung Chen, Dao-Long Chen | 2017-03-07 |
| 9578737 | Substrate structure and package structure using the same | Ming-Chiang Lee, Tsung-Hsun Lee, Chen-Chuan Fan | 2017-02-21 |
| 9564393 | Semiconductor device package and method of making the same | Chih-Yi Huang, Chi-Tsung Chiu | 2017-02-07 |