Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9741675 | Bump structures, semiconductor device and semiconductor device package having the same | Ping-Feng Yang, Chang-Chi Lee, Chien-Fan Chen | 2017-08-22 |
| 9589871 | Semiconductor package structure and method for manufacturing the same | Tang-Yuan Chen, Chin-Li KAO, Kuo-Hua Chen, Ming-Hung Chen | 2017-03-07 |