Issued Patents 2017
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9768139 | Semiconductor device and semiconductor package | Wan-Ting Chiu | 2017-09-19 |
| 9741675 | Bump structures, semiconductor device and semiconductor device package having the same | Dao-Long Chen, Ping-Feng Yang, Chang-Chi Lee | 2017-08-22 |