Issued Patents 2017
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9741675 | Bump structures, semiconductor device and semiconductor device package having the same | Dao-Long Chen, Ping-Feng Yang, Chien-Fan Chen | 2017-08-22 |
| 9589840 | Semiconductor package and manufacturing method thereof | Chin-Li KAO, Yi-Shao Lai | 2017-03-07 |