Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9574875 | Wafer or reticle thermal deformation measuring techniques | Kai-Fa Ho | 2017-02-21 |
| 9578737 | Substrate structure and package structure using the same | Kuo-Hua Chen, Ming-Chiang Lee, Chen-Chuan Fan | 2017-02-21 |