Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9748196 | Semiconductor package structure including die and substrate electrically connected through conductive segments | Kuo-Hua Chen | 2017-08-29 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9748196 | Semiconductor package structure including die and substrate electrically connected through conductive segments | Kuo-Hua Chen | 2017-08-29 |