Issued Patents 2016
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9425093 | Copper wiring forming method, film forming system, and storage medium | Tadahiro Ishizaka, Osamu Yokoyama, Kai-Hung Yu | 2016-08-23 |
| 9406557 | Copper wiring forming method with Ru liner and Cu alloy fill | Osamu Yokoyama, Cheonsoo Han, Chiaki Yasumuro, Tatsuo Hirasawa, Tadahiro Ishizaka +1 more | 2016-08-02 |
| 9406558 | Cu wiring fabrication method and storage medium | Tadahiro Ishizaka, Tatsuo Hirasawa, Osamu Yokoyama | 2016-08-02 |
| 9362166 | Method of forming copper wiring | Tadahiro Ishizaka, Osamu Yokoyama, Kenji Matsumoto, Peng Chang, Hiroyuki Nagai | 2016-06-07 |
| 9253862 | Plasma processing method and plasma processing apparatus | Tatsuo Hirasawa, Osamu Yokoyama, Chiaki Yasumuro, Toshiaki Fujisato, Ryota Yoshida +1 more | 2016-02-02 |