Issued Patents 2016
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9425093 | Copper wiring forming method, film forming system, and storage medium | Tadahiro Ishizaka, Takashi Sakuma, Kai-Hung Yu | 2016-08-23 |
| 9406557 | Copper wiring forming method with Ru liner and Cu alloy fill | Cheonsoo Han, Takashi Sakuma, Chiaki Yasumuro, Tatsuo Hirasawa, Tadahiro Ishizaka +1 more | 2016-08-02 |
| 9406558 | Cu wiring fabrication method and storage medium | Tadahiro Ishizaka, Tatsuo Hirasawa, Takashi Sakuma | 2016-08-02 |
| 9362166 | Method of forming copper wiring | Tadahiro Ishizaka, Takashi Sakuma, Kenji Matsumoto, Peng Chang, Hiroyuki Nagai | 2016-06-07 |
| 9279931 | Illuminating device and liquid crystal display apparatus | — | 2016-03-08 |
| 9253862 | Plasma processing method and plasma processing apparatus | Tatsuo Hirasawa, Chiaki Yasumuro, Toshiaki Fujisato, Ryota Yoshida, Takashi Sakuma +1 more | 2016-02-02 |