Issued Patents 2016
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9406557 | Copper wiring forming method with Ru liner and Cu alloy fill | Osamu Yokoyama, Cheonsoo Han, Takashi Sakuma, Tatsuo Hirasawa, Tadahiro Ishizaka +1 more | 2016-08-02 |
| 9253862 | Plasma processing method and plasma processing apparatus | Tatsuo Hirasawa, Osamu Yokoyama, Toshiaki Fujisato, Ryota Yoshida, Takashi Sakuma +1 more | 2016-02-02 |