Issued Patents 2016
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9425093 | Copper wiring forming method, film forming system, and storage medium | Takashi Sakuma, Osamu Yokoyama, Kai-Hung Yu | 2016-08-23 |
| 9406557 | Copper wiring forming method with Ru liner and Cu alloy fill | Osamu Yokoyama, Cheonsoo Han, Takashi Sakuma, Chiaki Yasumuro, Tatsuo Hirasawa +1 more | 2016-08-02 |
| 9406558 | Cu wiring fabrication method and storage medium | Tatsuo Hirasawa, Takashi Sakuma, Osamu Yokoyama | 2016-08-02 |
| 9368418 | Copper wiring structure forming method | Kenji Suzuki | 2016-06-14 |
| 9362166 | Method of forming copper wiring | Takashi Sakuma, Osamu Yokoyama, Kenji Matsumoto, Peng Chang, Hiroyuki Nagai | 2016-06-07 |
| 9313895 | Method for forming copper wiring | Kenji Suzuki, Atsushi Shimada | 2016-04-12 |