Issued Patents 2016
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9520362 | Semiconductor device having interconnect layer that includes dielectric segments interleaved with metal components | Chun-Chieh Lin, Hung-Wen Su, Syun-Ming Jang | 2016-12-13 |
| 9437485 | Method for line stress reduction through dummy shoulder structures | Cheng-Cheng Kuo, Tzu-Chun Lo, Ken-Yu Chang, Jye-Yen Cheng, Jeng-Shiun Ho +2 more | 2016-09-06 |
| 9397047 | Interconnect structure and method of forming the same | Jeng-Shiou Chen, Chih-Yuan Ting, Jyu-Horng Shieh | 2016-07-19 |
| 9269612 | Mechanisms of forming damascene interconnect structures | Chien-An Chen, Wen-Jiun Liu, Chun-Chieh Lin, Hung-Wen Su, Syun-Ming Jang | 2016-02-23 |