Issued Patents 2016
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9520362 | Semiconductor device having interconnect layer that includes dielectric segments interleaved with metal components | Chun-Chieh Lin, Ming-Hsing Tsai, Syun-Ming Jang | 2016-12-13 |
| 9518334 | Electro-plating and apparatus for performing the same | Chen-Yuan Kao, Minghsing Tsai | 2016-12-13 |
| 9496169 | Method of forming an interconnect structure having an air gap and structure thereof | Szu-Ping Tung, Chih-Chien Chi | 2016-11-15 |
| 9476135 | Electro chemical plating process | Chih-Yi Chang, Liang-Yueh Ou Yang, Chen-Yuan Kao | 2016-10-25 |
| 9343294 | Interconnect structure having air gap and method of forming the same | Chih-Chien Chi | 2016-05-17 |
| 9269612 | Mechanisms of forming damascene interconnect structures | Chien-An Chen, Wen-Jiun Liu, Chun-Chieh Lin, Ming-Hsing Tsai, Syun-Ming Jang | 2016-02-23 |
| 9240378 | Method of forming a copper layer using physical vapor deposition | Ken-Yu Chang | 2016-01-19 |