Issued Patents 2016
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9514928 | Selective repairing process for barrier layer | Chung-Chi Ko, Mei-Ling Chen, Huang-Yi Huang, Szu-Ping Tung, Ching-Hua Hsieh | 2016-12-06 |
| 9496169 | Method of forming an interconnect structure having an air gap and structure thereof | Szu-Ping Tung, Hung-Wen Su | 2016-11-15 |
| 9487864 | Metal capping process and processing platform thereof | Szu-Ping Tung, Huang-Yi Huang, Ching-Hua Hsieh | 2016-11-08 |
| 9472449 | Semiconductor structure with inlaid capping layer and method of manufacturing the same | Kuan-Chia Chen, Shing-Chyang Pan, Ching-Hua Hsieh | 2016-10-18 |
| 9343294 | Interconnect structure having air gap and method of forming the same | Hung-Wen Su | 2016-05-17 |
| 9324606 | Self-aligned repairing process for barrier layer | Chung-Chi Ko, Mei-Ling Chen, Huang-Yi Huang, Szu-Ping Tung, Ching-Hua Hsieh | 2016-04-26 |