Issued Patents 2016
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9520362 | Semiconductor device having interconnect layer that includes dielectric segments interleaved with metal components | Hung-Wen Su, Ming-Hsing Tsai, Syun-Ming Jang | 2016-12-13 |
| 9269612 | Mechanisms of forming damascene interconnect structures | Chien-An Chen, Wen-Jiun Liu, Hung-Wen Su, Ming-Hsing Tsai, Syun-Ming Jang | 2016-02-23 |