Issued Patents 2016
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9527818 | Method for producing sulfonyl amidine compound | Takashi Kikuchi, Shinya Yoshida, Takahiro Akiba, Toshitaka Yoshino, Shuichi Nakagawa +1 more | 2016-12-27 |
| 9503637 | Semiconductor device and image processing method | Hiroyuki Hamasaki, Manabu Koike, Hideaki KIDO, Nobuyasu Kanekawa | 2016-11-22 |
| 9472332 | Coil substrate, method of manufacturing the same, and inductor | Kiyokazu Sato | 2016-10-18 |
| 9417528 | Pattern forming method, multi-layered resist pattern, multi-layered film for organic solvent development, resist composition, method for manufacturing electronic device, and electronic device | Michihiro SHIRAKAWA, Keita Kato, Tadahiro ODANI, Hidenori Takahashi, Kaoru Iwato | 2016-08-16 |
| 9406432 | Inductor and coil substrate | Tsukasa Nakanishi, Kiyokazu Sato | 2016-08-02 |
| 9396874 | Method of manufacturing coil substrate and inductor | Tsukasa Nakanishi, Yoichi Sasada | 2016-07-19 |
| 9392692 | Wiring substrate having border portion separating two side metallic foils and manufacturing method of wiring substrate | Tsukasa Nakanishi, Takayuki Matsumoto | 2016-07-12 |
| 9367014 | Image forming apparatus, image forming system and image forming method | Miho Yamano, Hiroshi Matsumoto, Kazunori Nishinoue, Taizou Oonishi, Makoto Fujii | 2016-06-14 |
| 9348226 | Radiation-sensitive resin composition | Isao Nishimura, Kouichi Fujiwara, Eiichi Kobayashi, Tsutomu Shimokawa, Eiji Yoneda +1 more | 2016-05-24 |
| 9276185 | Light-emitting element mounting package having protruded wiring and recessed wiring, and light-emitting element package | Tsukasa Nakanishi, Takayuki Matsumoto | 2016-03-01 |
| 9274475 | Image forming apparatus, image forming system, and image forming method | Hiroshi Matsumoto, Kazunori Nishinoue, Taizou Oonishi, Makoto Fujii, Miho Yamano | 2016-03-01 |
| 9250532 | Pattern forming method, multi-layered resist pattern, multi-layered film for organic solvent development, resist composition, method for manufacturing electronic device, and electronic device | Keita Kato, Michihiro SHIRAKAWA, Tadahiro ODANI, Hidenori Takahashi, Kaoru Iwato | 2016-02-02 |