| 9520375 |
Method of forming a solder bump on a substrate |
Toyohiro Aoki, Yasumitsu Orii, Kazushige Toriyama, Shintaro Yamamichi |
2016-12-13 |
| 9508594 |
Fabricating pillar solder bump |
Toyohiro Aoki, Kazushige Toriyama |
2016-11-29 |
| 9499892 |
Sliding member and production method for same |
Hiroyuki Ishikawa, Shintaro Igarashi |
2016-11-22 |
| 9496064 |
Copper alloy for electric and electronic device, copper alloy sheet for electric and electronic device, conductive component for electric and electronic device, and terminal |
Kazunari Maki, Daiki Yamashita |
2016-11-15 |
| 9491351 |
Solid-state imaging device with autofocus and electronic apparatus |
Hitoshi Moriya, Kazuyoshi Yamashita, Hiroaki Ishiwata |
2016-11-08 |
| 9466533 |
Semiconductor structure including a through electrode, and method for forming the same |
Akihiro Horibe, Yasumitsu Orii, Kuniaki Sueoka, Kazushige Toriyama |
2016-10-11 |
| 9413566 |
Signal transmission circuit |
Keiji Shigeoka, Yoshifumi Kaku, Shogo Akasaki |
2016-08-09 |
| 9373545 |
Semiconductor structure including a through electrode, and method for forming the same |
Akihiro Horibe, Yasumitsu Orii, Kuniaki Sueoka, Kazushige Toriyama |
2016-06-21 |
| 9303003 |
Process for producing glycidyl (meth)acrylate |
Naoshi Murata |
2016-04-05 |
| 9299606 |
Fabricating pillar solder bump |
Toyohiro Aoki, Kazushige Toriyama |
2016-03-29 |
| 9270505 |
Communication system |
Keiji Shigeoka, Hideki Kashima, Tomohisa Kishigami |
2016-02-23 |
| 9252301 |
Solar cell and method for manufacturing solar cell |
Mitsuaki Morigami, Yuji Hishida, Daisuke Ide, Hitoshi Sakata, Takahiro Mishima +1 more |
2016-02-02 |
