Issued Patents 2016
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9520375 | Method of forming a solder bump on a substrate | Toyohiro Aoki, Hiroyuki Mori, Yasumitsu Orii, Kazushige Toriyama | 2016-12-13 |
| 9362262 | Semiconductor device | Manabu Okamoto, Hirokazu Honda | 2016-06-07 |
| 9362263 | Semiconductor device | Kenta Ogawa | 2016-06-07 |
| 9324663 | Semiconductor device including a plurality of magnetic shields | Takahito Watanabe, Yoshitaka Ushiyama | 2016-04-26 |