Issued Patents 2016
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9520375 | Method of forming a solder bump on a substrate | Toyohiro Aoki, Hiroyuki Mori, Yasumitsu Orii, Shintaro Yamamichi | 2016-12-13 |
| 9508594 | Fabricating pillar solder bump | Toyohiro Aoki, Hiroyuki Mori | 2016-11-29 |
| 9466533 | Semiconductor structure including a through electrode, and method for forming the same | Akihiro Horibe, Hiroyuki Mori, Yasumitsu Orii, Kuniaki Sueoka | 2016-10-11 |
| 9391034 | Interfacial alloy layer for improving electromigration (EM) resistance in solder joints | Hirokazu Noma, Yasumitsu Orii | 2016-07-12 |
| 9373545 | Semiconductor structure including a through electrode, and method for forming the same | Akihiro Horibe, Hiroyuki Mori, Yasumitsu Orii, Kuniaki Sueoka | 2016-06-21 |
| 9354408 | Via for electrical contact passing through layers of optical waveguide in multilayer structure including electrical substrate and laminated layers of optical waveguide | Hirokazu Noma, Keishi Okamoto, Masao Tokunari, Yutaka Tsukada | 2016-05-31 |
| 9299606 | Fabricating pillar solder bump | Toyohiro Aoki, Hiroyuki Mori | 2016-03-29 |