Issued Patents 2016
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9520375 | Method of forming a solder bump on a substrate | Hiroyuki Mori, Yasumitsu Orii, Kazushige Toriyama, Shintaro Yamamichi | 2016-12-13 |
| 9508594 | Fabricating pillar solder bump | Hiroyuki Mori, Kazushige Toriyama | 2016-11-29 |
| 9299606 | Fabricating pillar solder bump | Hiroyuki Mori, Kazushige Toriyama | 2016-03-29 |