Issued Patents 2016
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9520375 | Method of forming a solder bump on a substrate | Toyohiro Aoki, Hiroyuki Mori, Kazushige Toriyama, Shintaro Yamamichi | 2016-12-13 |
| 9466533 | Semiconductor structure including a through electrode, and method for forming the same | Akihiro Horibe, Hiroyuki Mori, Kuniaki Sueoka, Kazushige Toriyama | 2016-10-11 |
| 9391034 | Interfacial alloy layer for improving electromigration (EM) resistance in solder joints | Hirokazu Noma, Kazushige Toriyama | 2016-07-12 |
| 9373545 | Semiconductor structure including a through electrode, and method for forming the same | Akihiro Horibe, Hiroyuki Mori, Kuniaki Sueoka, Kazushige Toriyama | 2016-06-21 |