Issued Patents 2016
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9508704 | Method of fabricating semiconductor package, semiconductor package formed thereby, and semiconductor device including the same | Inyoung Lee, Taeje Cho | 2016-11-29 |
| 9362172 | Semiconductor devices having through-vias and methods for fabricating the same | Kyu-Ha Lee, Ho-Jin Lee, Pil-Kyu Kang, Byung-Lyul Park, Gilheyun Choi | 2016-06-07 |
| 9355961 | Semiconductor devices having through-electrodes and methods for fabricating the same | Chajea Jo, Taeje Cho | 2016-05-31 |
| 9287140 | Semiconductor packages having through electrodes and methods of fabricating the same | Jongyeon Kim, In-Young Lee, Tae-Je Cho | 2016-03-15 |
| 9245771 | Semiconductor packages having through electrodes and methods for fabricating the same | Keum-Hee Ma, In-Young Lee, Moon Gi Cho, Chajea Jo, Taeje Cho | 2016-01-26 |