Issued Patents 2016
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9530726 | Semiconductor device and method of fabricating the same | Kwang-Jin Moon, Byung-Iyul Park, Dong-Chan Lim, Deok-Young Jung, Gil-Heyun Choi +1 more | 2016-12-27 |
| 9530706 | Semiconductor devices having hybrid stacking structures and methods of fabricating the same | Byung-Lyul Park, Taeyeong Kim, Yeun-Sang Park, Dosun Lee, Ho-Jin Lee +3 more | 2016-12-27 |
| 9520361 | Semiconductor devices | Seok Ho Kim, Tae-Yeong Kim, Hyo Ju Kim, Byung-Lyul Park, Joo-Hee Jang +1 more | 2016-12-13 |
| 9461007 | Wafer-to-wafer bonding structure | Jin-ho Chun, Byung-Lyul Park, Jae-Hwa Park, Ju-Il Choi | 2016-10-04 |
| 9362172 | Semiconductor devices having through-vias and methods for fabricating the same | Kyu-Ha Lee, Ho-Jin Lee, Byung-Lyul Park, Hyunsoo Chung, Gilheyun Choi | 2016-06-07 |
| 9312171 | Semiconductor devices having through-electrodes and methods for fabricating the same | Kyu-Hee Han, Taejin Yim, Naein Lee | 2016-04-12 |
| 9287251 | Method of manufacturing a semiconductor device | Seok Ho Kim, Tae-Yeong Kim, Hyo Ju Kim, Byung-Lyul Park, Yeun-Sang Park +4 more | 2016-03-15 |
| 9236349 | Semiconductor device including through via structures and redistribution structures | Kyu-Ha Lee, Tae-Yeong Kim, Ho-Jin Lee, Byung-Lyul Park, Gil-Heyun Choi | 2016-01-12 |