Issued Patents 2016
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9530706 | Semiconductor devices having hybrid stacking structures and methods of fabricating the same | Pil-Kyu Kang, Taeyeong Kim, Yeun-Sang Park, Dosun Lee, Ho-Jin Lee +3 more | 2016-12-27 |
| 9520361 | Semiconductor devices | Pil-Kyu Kang, Seok Ho Kim, Tae-Yeong Kim, Hyo Ju Kim, Joo-Hee Jang +1 more | 2016-12-13 |
| 9502274 | Wafer loaders having buffer zones | Yi Koan Hong, Jumyong Park, Jisoon Park, Kyu-Ha Lee, Siyoung Choi | 2016-11-22 |
| 9496218 | Integrated circuit device having through-silicon-via structure | Do-Sun Lee, Kun-Sang Park, Seong Min Son, Gil-Heyun Choi | 2016-11-15 |
| 9496163 | Carrier and method of fabricating semiconductor device using the same | Hyungjun Jeon, Jisoon Park | 2016-11-15 |
| 9490216 | Semiconductor device and semiconductor package | Kwang-Jin Moon, Tae-Seong Kim, Jae-Hwa Park, Suk-Chul Bang | 2016-11-08 |
| 9461007 | Wafer-to-wafer bonding structure | Jin-ho Chun, Pil-Kyu Kang, Jae-Hwa Park, Ju-Il Choi | 2016-10-04 |
| 9431341 | Semiconductor device having metal patterns and piezoelectric patterns | Yi Koan Hong, Ji-Soon Park, Si-Young Choi | 2016-08-30 |
| 9379042 | Integrated circuit devices having through silicon via structures and methods of manufacturing the same | Jae-Hwa Park, Suk-Chul Bang, Kwang-Jin Moon | 2016-06-28 |
| 9362172 | Semiconductor devices having through-vias and methods for fabricating the same | Kyu-Ha Lee, Ho-Jin Lee, Pil-Kyu Kang, Hyunsoo Chung, Gilheyun Choi | 2016-06-07 |
| 9337125 | Integrated circuit devices including a via structure and methods of fabricating integrated circuit devices including a via structure | Jae-Hwa Park, Kwang-Jin Moon | 2016-05-10 |
| 9287251 | Method of manufacturing a semiconductor device | Pil-Kyu Kang, Seok Ho Kim, Tae-Yeong Kim, Hyo Ju Kim, Yeun-Sang Park +4 more | 2016-03-15 |
| 9252141 | Semiconductor integrated circuit, method for fabricating the same, and semiconductor package | Kwang-Jin Moon, Jae-Hwa Park | 2016-02-02 |
| 9236349 | Semiconductor device including through via structures and redistribution structures | Kyu-Ha Lee, Pil-Kyu Kang, Tae-Yeong Kim, Ho-Jin Lee, Gil-Heyun Choi | 2016-01-12 |