Issued Patents 2016
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9412707 | Method of manufacturing semiconductor package | Hyun-Soo Chung, Tae-Je Cho, Jung-Seok Ahn | 2016-08-09 |
| 9287140 | Semiconductor packages having through electrodes and methods of fabricating the same | Hyunsoo Chung, Jongyeon Kim, Tae-Je Cho | 2016-03-15 |
| 9245771 | Semiconductor packages having through electrodes and methods for fabricating the same | Hyunsoo Chung, Keum-Hee Ma, Moon Gi Cho, Chajea Jo, Taeje Cho | 2016-01-26 |