Issued Patents 2016
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9508704 | Method of fabricating semiconductor package, semiconductor package formed thereby, and semiconductor device including the same | Hyunsoo Chung, Inyoung Lee | 2016-11-29 |
| 9461029 | Semiconductor packages and methods for fabricating the same | Hye-Young Jang, Chang-Seong Jeon, Chajea Jo | 2016-10-04 |
| 9355961 | Semiconductor devices having through-electrodes and methods for fabricating the same | Chajea Jo, Hyunsoo Chung | 2016-05-31 |
| 9275903 | Method of manufacturing semiconductor device substrate with crystal structure reformation regions | Byoung-Soo Kwak, Youngsu Kim, Sangwook Park | 2016-03-01 |
| 9245771 | Semiconductor packages having through electrodes and methods for fabricating the same | Hyunsoo Chung, Keum-Hee Ma, In-Young Lee, Moon Gi Cho, Chajea Jo | 2016-01-26 |