Issued Patents 2016
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9466585 | Reducing defects in wafer level chip scale package (WLCSP) devices | Leonardus Antonius Elisabeth van Gemert, Roelf Anco Jacob Groenhuis, Caroline Catharina Maria Beelen-Hendrikx, Franciscus Henrikus Martinus Swartjes, Jetse de Witte | 2016-10-11 |
| 9424507 | Dual interface IC card components and method for manufacturing the dual-interface IC card components | Christian Zenz, Johannes Wilhelmus van Rijckevorsel, Bodin Kasemset, David Ceccarelli, Boudewijn van Blokland +1 more | 2016-08-23 |
| 9379071 | Single inline no-lead semiconductor package | Jan Gulpen, Jan Willem Bergman | 2016-06-28 |
| 9245804 | Using a double-cut for mechanical protection of a wafer-level chip scale package (WLCSP) | Christian Zenz, Hartmut Buenning, Leonardus Antonius Elisabeth van Gemert, Sascha Moeller | 2016-01-26 |