Issued Patents 2016
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9349645 | Apparatus, device and method for wafer dicing | Martin Lapke, Hartmut Buenning, Guido Albermann, Thomas Rohleder, Heiko Backer | 2016-05-24 |
| 9245804 | Using a double-cut for mechanical protection of a wafer-level chip scale package (WLCSP) | Christian Zenz, Hartmut Buenning, Leonardus Antonius Elisabeth van Gemert, Tonny Kamphuis | 2016-01-26 |