Issued Patents 2016
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9466585 | Reducing defects in wafer level chip scale package (WLCSP) devices | Tonny Kamphuis, Roelf Anco Jacob Groenhuis, Caroline Catharina Maria Beelen-Hendrikx, Franciscus Henrikus Martinus Swartjes, Jetse de Witte | 2016-10-11 |
| 9385099 | Die interconnect | Coenraad Cornelis Tak, Marten Oldsen, Hendrik Bouman | 2016-07-05 |
| 9263299 | Exposed die clip bond power package | Emil Casey Israel | 2016-02-16 |
| 9245804 | Using a double-cut for mechanical protection of a wafer-level chip scale package (WLCSP) | Christian Zenz, Hartmut Buenning, Tonny Kamphuis, Sascha Moeller | 2016-01-26 |