Issued Patents 2016
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9466585 | Reducing defects in wafer level chip scale package (WLCSP) devices | Tonny Kamphuis, Leonardus Antonius Elisabeth van Gemert, Caroline Catharina Maria Beelen-Hendrikx, Franciscus Henrikus Martinus Swartjes, Jetse de Witte | 2016-10-11 |
| 9418918 | Lead for connection to a semiconductor device | Tim Boettcher | 2016-08-16 |
| 9418919 | Leadless chip carrier having improved mountability | Markus Björn Erik Noren, Fei Ying Wong, Hei Ming Shiu | 2016-08-16 |
| 9263335 | Discrete semiconductor device package and manufacturing method | Tim Boettcher, Sven Walczyk, Rolf Brenner, Emiel de Bruin | 2016-02-16 |