Issued Patents 2016
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9466585 | Reducing defects in wafer level chip scale package (WLCSP) devices | Tonny Kamphuis, Leonardus Antonius Elisabeth van Gemert, Roelf Anco Jacob Groenhuis, Franciscus Henrikus Martinus Swartjes, Jetse de Witte | 2016-10-11 |