Issued Patents 2016
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9349645 | Apparatus, device and method for wafer dicing | Martin Lapke, Hartmut Buenning, Sascha Moeller, Thomas Rohleder, Heiko Backer | 2016-05-24 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9349645 | Apparatus, device and method for wafer dicing | Martin Lapke, Hartmut Buenning, Sascha Moeller, Thomas Rohleder, Heiko Backer | 2016-05-24 |