Issued Patents 2016
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9524948 | Package structure | Yu-Hua Huang, Wei-Che Huang, Ming-Tzong Yang | 2016-12-20 |
| 9520349 | Semiconductor package | Wen-Sung Hsu, Ta-Jen Yu | 2016-12-13 |
| 9437512 | Integrated circuit package structure | Thomas Matthew Gregorich | 2016-09-06 |
| 9437534 | Enhanced flip chip structure using copper column interconnect | Thomas Matthew Gregorich, Che-Ya Chou | 2016-09-06 |