Issued Patents 2016
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9520349 | Semiconductor package | Tzu-Hung Lin, Ta-Jen Yu | 2016-12-13 |
| 9437457 | Chip package having a patterned conducting plate and method for forming the same | Ming-Chieh Lin, Ta-Jen Yu | 2016-09-06 |
| 9437577 | Package on package structure with pillar bump pins and related method thereof | Shih-Chin Lin | 2016-09-06 |
| 9373526 | Chip package and method for forming the same | Ming-Chieh Lin, Ta-Jen Yu | 2016-06-21 |
| 9252068 | Semiconductor package | Tai-Yu Chen, Chung-Fa Lee, Shih-Chin Lin | 2016-02-02 |