Issued Patents 2016
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9520349 | Semiconductor package | Wen-Sung Hsu, Tzu-Hung Lin | 2016-12-13 |
| 9437457 | Chip package having a patterned conducting plate and method for forming the same | Wen-Sung Hsu, Ming-Chieh Lin | 2016-09-06 |
| 9373526 | Chip package and method for forming the same | Wen-Sung Hsu, Ming-Chieh Lin | 2016-06-21 |