Issued Patents 2016
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9524948 | Package structure | Tzu-Hung Lin, Yu-Hua Huang, Wei-Che Huang | 2016-12-20 |
| 9425098 | Radio-frequency device package and method for fabricating the same | Cheng-Chou Hung, Tung-Hsing Lee, Wei-Che Huang, Yu-Hua Huang | 2016-08-23 |
| 9373727 | Semiconductor diode | Tung-Hsing Lee | 2016-06-21 |
| 9269664 | Semiconductor package with through silicon via interconnect and method for fabricating the same | Cheng-Chou Hung, Yu-Hua Huang, Wei-Che Huang | 2016-02-23 |
| 9257392 | Semiconductor package with through silicon via interconnect | Yu-Hua Huang, Wei-Che Huang | 2016-02-09 |