Issued Patents 2016
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9472451 | Technique for wafer-level processing of QFN packages | Viren Khandekar, Karthik Thambidurai, Ahmad Ashrafzadeh, Hien D. Nguyen | 2016-10-18 |
| 9331048 | Bonded stacked wafers and methods of electroplating bonded stacked wafers | Quanbo Zou, Uppili Sridhar, Xuejun Ying | 2016-05-03 |
| 9324687 | Wafer-level passive device integration | Karthik Thambidurai, Peter R. Harper, Viren Khandekar | 2016-04-26 |