Issued Patents 2016
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9331048 | Bonded stacked wafers and methods of electroplating bonded stacked wafers | Quanbo Zou, Amit S. Kelkar, Xuejun Ying | 2016-05-03 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9331048 | Bonded stacked wafers and methods of electroplating bonded stacked wafers | Quanbo Zou, Amit S. Kelkar, Xuejun Ying | 2016-05-03 |