Issued Patents 2016
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9343612 | Method of bonding a semiconductor device to a support substrate | Salman Akram, Jerome Chanra Bhat | 2016-05-17 |
| 9331048 | Bonded stacked wafers and methods of electroplating bonded stacked wafers | Uppili Sridhar, Amit S. Kelkar, Xuejun Ying | 2016-05-03 |