Issued Patents 2016
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9478519 | Package including a semiconductor die and a capacitive component | Vijay Ullal, Justin Chiang, Daniel M. Kinzer, Michael M. Dube, Oseob Jeon +2 more | 2016-10-25 |
| 9472451 | Technique for wafer-level processing of QFN packages | Viren Khandekar, Karthik Thambidurai, Amit S. Kelkar, Hien D. Nguyen | 2016-10-18 |
| 9367502 | Communication methods and apparatus and power supply controllers using the same | — | 2016-06-14 |