Issued Patents 2016
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9472451 | Technique for wafer-level processing of QFN packages | Viren Khandekar, Ahmad Ashrafzadeh, Amit S. Kelkar, Hien D. Nguyen | 2016-10-18 |
| 9425064 | Low-cost low-profile solder bump process for enabling ultra-thin wafer-level packaging (WLP) packages | Viren Khandekar, Tiao Zhou | 2016-08-23 |
| 9324687 | Wafer-level passive device integration | Amit S. Kelkar, Peter R. Harper, Viren Khandekar | 2016-04-26 |