Issued Patents 2016
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9425064 | Low-cost low-profile solder bump process for enabling ultra-thin wafer-level packaging (WLP) packages | Karthik Thambidurai, Viren Khandekar | 2016-08-23 |
| 9371982 | Glass based multichip package | — | 2016-06-21 |
| 9356003 | Highly integrated flex sensor package | — | 2016-05-31 |