Issued Patents 2016
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9502367 | Semiconductor device including a cap facing a semiconductor chip and a bump electrode provided between the semiconductor chip and the cap | Yutaka Onozuka, Hiroshi Yamada, Nobuto Managaki | 2016-11-22 |
| 9468089 | EBG structure, semiconductor device, and circuit board | Hiroshi Yamada | 2016-10-11 |
| 9406622 | Electronic circuit and semiconductor component | Kazuhiko Itaya, Hiroshi Yamada | 2016-08-02 |
| 9299627 | Semiconductor package having a cap unit with concave portion and method of manufacturing the same | Toshihiko Nagano, Kazuhide Abe, Hiroshi Yamada, Kazuhiko Itaya, Taihei Nakada | 2016-03-29 |