Issued Patents 2016
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9490237 | Semiconductor package including a plurality of chips | Hiroshi Yamada, Yutaka Onozuka, Atsuko Iida | 2016-11-08 |
| 9406622 | Electronic circuit and semiconductor component | Tadahiro Sasaki, Hiroshi Yamada | 2016-08-02 |
| 9299627 | Semiconductor package having a cap unit with concave portion and method of manufacturing the same | Toshihiko Nagano, Tadahiro Sasaki, Kazuhide Abe, Hiroshi Yamada, Taihei Nakada | 2016-03-29 |
| 9284186 | Semiconductor device and method of manufacturing the same | Hiroshi Yamada, Hideyuki Funaki, Kazuhiro Suzuki, Armon Mahajerin, Kevin Limkrailassiri +1 more | 2016-03-15 |